Porous Material with Low Thermal Conductivity ID: 2013-023

A novel porous material designed for exceptional thermal isolation compatible with semiconductor fabrication techniques.

Technology Overview

This technology involves a unique process of growing carbon nanotubes, coating them with silicon dioxide, and then oxidizing the nanotubes to leave behind a porous oxide network. The resulting material exhibits thermal conductivity similar to that of air, making it an ideal candidate for applications requiring thermal isolation.

Key Advantages

• Low thermal conductivity comparable to air
• Compatibility with semiconductor fabrication techniques
• Superior to silica aerogels in terms of integration into existing manufacturing processes
• Potential for a wide range of applications including thermal sensors and micromachining

Problems Addressed

• Need for materials with low thermal conductivity for thermal isolation in electronics
• Lack of materials compatible with semiconductor fabrication processes
• Difficulty in integrating existing low thermal conductivity materials into semiconductor devices

Market Applications

• Thermal isolation layers in chip-based heaters and electronic devices
• Thermal imaging sensors
• Chemical sensors
• Micromachining and advanced manufacturing processes

Additional Information

Technology ID: 2013-023
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 13 May, 2025