Nanoscale Interconnects and Circuits via DNA Origami ID: 2016-010
A groundbreaking method for creating smaller, more affordable electronic devices through DNA origami.
Photo by TopMicrobialStock - stock.adobe.com
Technology Overview
This technology utilizes DNA origami to construct complex, nano-sized 3D structures that can interface with metals and semiconductors, aiming to revolutionize the electronics and computer circuit industries. Developed at Brigham Young University, it offers a novel approach to producing electronic devices at a nanoscale, potentially outperforming existing manufacturing techniques in terms of size and cost.
Key Advantages
- Enables the production of significantly smaller electronic components
- Reduces manufacturing costs compared to current technologies
- Offers precise control over the assembly of nanoscale structures
- Facilitates the integration of biological and electronic systems
Problems Addressed
- Limitations in reducing the size of electronic devices with current technology
- High costs associated with nanoscale manufacturing
- Complexity in creating 3D nano-sized electronic circuits and interconnects
Market Applications
- Manufacturing of advanced electronic devices
- Development of next-generation computer circuits
- Potential licensing opportunities for tech firms like Intel and Motorola
- Research and development in semiconductor technologies
Additional Information
Technology ID: 2022-002
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 28 March, 2025
Connect with the Tech Transfer to:
- Meet with the technology manager
- Receive additional information
- Request a marketing plan report