Microstructural Engineering with Spatially Controlled Stress Fields

Microstructural Engineering with Spatially Controlled Stress Fields ID: 2023-010

An innovative approach to precisely control the microstructure of materials using spatially controlled stress fields.

Technology Overview:

This technology leverages spatially controlled stress fields and the elastic anisotropy of materials to influence the crystallographic texture during synthesis or manufacturing processes. By applying acoustic stress fields, the orientation of crystalline nuclei during solidification can be controlled, as well as the orientation distribution of second-phase particles within a solid matrix. This method also allows for the application of static or dynamic stress fields during film deposition to guide the growth of optimally oriented domains.

Key Advantages

Enables precise microstructural control at a high spatial resolution.
Facilitates the development of materials with tailored properties.
Applicable to a wide range of materials, including structural, electronic, optical, energy, and magnetic materials.

Problems Solved

Overcomes the limitations of existing methods like sheet metal rolling which only offer coarse or statistical control.
Addresses the challenge of achieving targeted material properties through microstructural manipulation.

Market Applications

Structural materials with enhanced durability and performance.
Electronic and optical components with optimized properties.
Advanced energy generation and storage materials.
Magnetic materials with tailored characteristics.

Stage of Development

The technology is in the early development stage. It has not been prototyped or publicly disclosed, with ongoing private communications within the research lab indicating it is still in the conceptual phase.

Additional Information

Technology ID: 2023-010
Sell Sheet: Download the Sell Sheet here
Marketing Analysis: Link to Market Analysis here
Date Published: March 18, 2025