Low-Temperature Plasma Process for Bulk Material Ordering ID: 2012-010

An innovative process that uses low-temperature plasma to induce ordering in polymer films for enhanced material properties.

Technology Overview

This technology involves a novel plasma treatment of polymer films on conducting or semiconducting substrates to achieve ordered alignment of polymer functional groups or copolymer domains. Unlike traditional methods that require heating and electric fields, this approach uses low-temperature plasma to reorient the material's bulk, aligning it perpendicularly to the substrate. This process is not only faster and more cost-effective but also leverages existing laboratory equipment, making it an accessible advancement in material processing.

Key Advantages

• Increased efficiency and speed of bulk material ordering compared to traditional methods
• Cost-effective by utilizing existing lab equipment and avoiding expensive processing steps
• Energy-efficient process that does not require heating or electric fields
• Enables precise control over the orientation of polymer functional groups or domains

Problems Addressed

• High cost and energy consumption of traditional material ordering processes
• Limited control over the bulk orientation of materials using conventional methods
• Accessibility and scalability of advanced material processing techniques

Market Applications

• Manufacturing of nanoporous films for nanotechnology applications
• Enhancement of material properties in semiconductors and conductive substrates
• Advanced research and development in material science and engineering
• Potential applications in electronics, optics, and biomedical devices requiring precise material alignment

Additional Information

Technology ID: 2012-010
Sell Sheet: Download the Sell Sheet here
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Date Published: 30 June, 2025