Hybrid Package-less PDMS-CMOS-FR4 Contact-Imaging System for Microfluidics ID: 2018-025

A groundbreaking imaging system that integrates directly with microfluidic devices for enhanced sensitivity and scalability.

Technology Overview

This technology represents a novel approach to integrating imaging systems with microfluidic devices, utilizing a hybrid package-less structure that combines polydimethylsiloxane (PDMS), complementary metal-oxide-semiconductor (CMOS) sensors, and FR4 material. By embedding the CMOS sensor within PDMS layers, it facilitates larger, more complex microfluidic designs and improves optical efficiency without the need for conventional semiconductor packaging.

Key Advantages

• Enables integration with larger and more complex microfluidic structures
• Eliminates the need for conventional semiconductor packaging, reducing size and cost
• Enhances optical efficiency and sensitivity through direct embedding of CMOS sensors in PDMS
• Incorporates integrated valves for improved manipulation within microfluidic environments

Problems Addressed

• Limitations in the scalability and complexity of microfluidic devices
• Decreased sensitivity and efficiency in optical detection within microfluidic systems
• Challenges in integrating imaging systems with microfluidic environments due to conventional packaging constraints

Market Applications

• Medical diagnostics and analysis
• Chemical detection and analysis
• Research and development in microfluidic technologies
• Biomedical engineering and device fabrication

Additional Information

Technology ID: 2018-025
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 28 March, 2025