Evaluation and Prediction of Failure Modes in Coextruded Multilayer Polymer Films ID: 2018-038
This study provides advanced methodologies for predicting and evaluating failure modes in multilayer polymer films used in packaging, focusing on puncture and abrasion during shipment.
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Technology Overview
The document presents a comprehensive study on the resilience of coextruded multilayer polymer films against stresses encountered during shipping and distribution. It explores the behavior of thermoformed polymer films, emphasizing the impact of film thickness and material composition on failure rates. Through rigorous testing and methodology modifications, the study aims to pre-evaluate material resilience to minimize packaging failures.
Key Advantages
- Introduction of advanced predictive methods for material evaluation
- Modification of ASTM methods to better simulate real-world shipping impacts
- Development of a new test apparatus for more accurate film evaluation
- Comprehensive analysis of material behavior under stress
Problems Addressed
- Reduction in packaging failure rates during transit
- Identification of superior film candidates with minimal post-test leaks
- Improved understanding of the impact of film thickness and composition on durability
Market Applications
- Enhanced packaging solutions for industries reliant on polymer film packaging
- Pre-screening tests for new polymer film materials before market launch
- Development of automated testing systems for efficient material evaluation
Additional Information
Technology ID: 2018-038
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 28 March, 2025
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