Diamond Encapsulated Sensor for High-Temperature Thermal Property Measurements

Diamond Encapsulated Sensor for High-Temperature Thermal Property Measurements ID: 2022-001

An innovative sensor designed for precise thermal property measurements of molten halide salts, employing diamond encapsulation to withstand high temperatures and corrosive environments.

Technology Overview:

This technology involves a diamond encapsulated sensor that utilizes the transient hot-wire (THW) technique for thermal conductivity measurements. Specifically designed for use with molten halide salts, the sensor features a tungsten wire pattern encapsulated within a diamond substrate. This design addresses the challenges posed by the corrosive and electrically conductive nature of molten salts, which limit the effectiveness of traditional measurement techniques.

Key Advantages

High thermal conductivity and corrosion resistance due to diamond encapsulation.
Eliminates common issues associated with steady-state measurement techniques, such as convective heat losses and calibration requirements.
Modular design allows for the simultaneous manufacturing of multiple sensors on a single wafer.
Operates with low measurement uncertainty, potentially reducing errors to about ±1%.

Problems Solved

Measurement inaccuracies in high-temperature, corrosive environments.
Convective heat losses and calibration requirements that hinder traditional thermal property measurement techniques.
Challenges in measuring thermal properties of electrically conductive molten salts.

Market Applications

Industrial process control in environments involving molten halide salts.
Quality assurance and materials research for high-temperature applications.
Potential industrial collaborations for technology commercialization and market entry.

Additional Information

Technology ID: 2022-001
Sell Sheet: Download the Sell Sheet here
Date Published: March 21, 2025