Deployable Thick Origami Tessellation for Spinal Implants ID: 2017-080
This invention introduces a novel spinal implant design using thick origami principles for minimal invasive insertion and effective load support.
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Technology Overview
The technology leverages thick origami tessellations to develop spinal implants that are compact during insertion yet unfold to support loads effectively once in place. It utilizes 2D tessellations to create 3D structures, aiming to reduce the size of surgical incisions, minimize trauma, and potentially lower recovery times and insurance costs. This approach allows the implant to deploy in one direction while supporting loads perpendicularly, ensuring minimal folded size without compromising structural integrity.
Key Advantages
- Less invasive procedures due to compact insertion size
- Reduced surgical trauma and potential for quicker recovery
- Decreased insurance costs through improved procedural efficiency
- Enhanced load support with minimal structural compromise
Problems Addressed
- Large surgical incisions and associated trauma with traditional spinal implants
- Extended recovery times and high medical costs
- Lack of structural integrity in minimally invasive implant designs
Market Applications
- Spinal surgery implants and procedures
- Biomedical devices requiring minimal invasiveness and high load support
- Engineering design projects focusing on origami-based technologies
Additional Information
Technology ID: 2017-080
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 28 March, 2025
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