Buffer Powder as Pressure Control for Micro-Brazing Metallic Microfluidic Interfaces Skip to main content

Buffer Powder as Pressure Control for Micro-Brazing Metallic Microfluidic Interfaces ID: 2024-050

A novel method to create zero dead-volume, thermally stable interfaces for gas chromatography micro-columns using pressure-controlled micro-brazing.

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Technology Overview

This technology introduces an innovative approach to seal stainless steel capillaries to microcolumns for gas chromatography, utilizing a micro-brazing process with copper in an inert atmosphere. Stainless steel powder is employed to absorb excess copper, effectively preventing clogging and ensuring a seamless, stable connection at the interface. This method significantly enhances the performance of metallic microfluidic interfaces by eliminating dead-volume and providing thermal stability up to 400°C.


Key Advantages

  • Eliminates dead-volume at the inlet and outlet interfaces
  • Ensures thermal stability up to 400°C, improving reliability under high-temperature conditions
  • Prevents clogging by using stainless steel powder to absorb excess copper during the brazing process
  • Offers a significant improvement over existing methods by providing a seamless and stable microcolumn interface

Problems Addressed

  • Dead-volume in micro-columns for gas chromatography, leading to sample loss and analysis inaccuracies
  • Thermal instability at the inlet and outlet interfaces of microcolumns, affecting performance and reliability
  • Complexity and inefficiency in creating durable, high-performance metallic microfluidic interfaces

Market Applications

  • Gas chromatography, particularly in enhancing the performance of metallic microcolumns
  • Microfluidic applications requiring durable and thermally stable metallic interfaces
  • Any field requiring precise control over micro-scale fluid flow and analysis, benefiting from reduced dead-volume and improved thermal stability

Additional Information

Technology ID: 2024-050
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 07 May, 2025

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