3D DNA Origami Nanoelectronics ID: 2016-010
A revolutionary approach to creating nanoscale interconnects and circuits for electronics through DNA.
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Technology Overview
This novel invention from Brigham Young University utilizes DNA origami techniques to form intricate nanoscale electronic components, including interconnects and circuits. By leveraging the unique properties of DNA, this technology enables the production of electronic devices that are smaller, less expensive, and more complex than those currently available. The process involves designing 3D structures that can interface with metals and semiconductors to create multi-material architectures, a feat not achievable with existing technologies.
Key Advantages
- Enables the creation of electronic components smaller than 10 nm
- Potential for large-scale production due to the efficiency of DNA assembly
- Capability to design intricate 3D structures for advanced electronic applications
Problems Addressed
- Overcomes limitations in the miniaturization of electronic components
- Reduces the cost and complexity of producing nanoscale electronics
- Surpasses existing methods by enabling multi-material architecture in electronics
Market Applications
- Advanced computing devices requiring nanoscale circuits and interconnects
- Next-generation electronics manufacturing, particularly for semiconductors
- Innovative applications in wearable technology, medical devices, and more
Additional Information
Technology ID: 2016-010
Sell Sheet: Download the Sell Sheet here
Market Analysis: Contact us for a more in-depth market report
Date Published: 16 June, 2025
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